Blue Cheetah Analog Design - Chiplet Ecosystem

Blue Cheetah provides highly optimized, rapidly customized die-to-die interconnect IP. Our chiplet interconnect IP solutions are configurable for packaging type, data rate, I/O configuration, process, and more. They are optimized to meet your application’s power, performance, area, and latency requirements. Our BlueLynx technology is based on the Bunch of Wires (BoW) open die-to-die (D2D) interface from the Open Compute Project (OCP) and supports Universal Chiplet Interconnect Express (UCIe). Our solutions support both standard organic chip packaging and advanced packaging technology.