A cost analysis of the chiplet as a SoC solution
By Chetan Arvind Patil, NXP
CMM Magazine (November 9, 2023)
The chiplet has become one of the most promising more-than-Moore (MtM) solutions, mainly for the system-on-a-chip (SoC) because it is nearing the reticle limit with every new process technology node. The SoC is also the ideal candidate for the chiplet, largely due to the ability to split the SoC’s circuit blocks into multiple design and manufacturing flows, which can then be aggregated using advanced, heterogenous integration solutions. Moreover, the SoC will eventually enable better power, performance, area, cost and time-to-market to be achieved.
AMD's EPYC and Ryzen processor families have already shown how impactful the chiplet is, for example, ways artificial intelligence (AI) workloads can make the most of new architectures developed with the chiplet. Slowly, the chiplet is also becoming the method of choice of emerging SoC startups such as Tenstorrent, which create chiplet-based architectures for the complex workloads that the computing industry will have to handle due to AI growth.
While no one can argue the benefits of incorporating a disaggregated way of using the chiplet to develop SoCs, one needs to take a close look at the cost impact on semiconductor manufacturing. It is, of course, crucial in making or breaking any silicon product and the basis of enabling a viable business for the vendors developing SoCs.
Related Chiplet
- UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
- UCIe based 8-bit 48-Gsps Transceiver
- UCIe based 12-bit 12-Gsps Transceiver
- 400G Transmitter Chiplet for 400G, 800G and 1.6T Pluggable Transceivers
- FPGA Chiplets with 40K -600K LUTS
Related Technical Papers
- Stop-For-Top IP model to replace One-Stop-Shop by 2025... and support the creation of successful Chiplet business
- The Revolution of Chiplet Technology in Automotive Electronics and Its Impact on the Supply Chain
- The Next Frontier in Semiconductor Innovation: Chiplets and the Rise of 3D-ICs
- Business Analysis of Chiplet-Based Systems and Technology
Latest Technical Papers
- Complex Heterogeneous Integration Drives Innovation In Semiconductor Test
- The Evolution of Photonic Integrated Circuits and Silicon Photonics
- Flexible electronic-photonic 3D integration from ultrathin polymer chiplets
- Enabling Innovative Multi-Vendor Chiplet-Based Designs
- Cambricon-LLM: A Chiplet-Based Hybrid Architecture for On-Device Inference of 70B LLM