Breaking Down Die Size Barriers with Chiplets
Why are hyperscalers moving towards chiplet ecosystems?
Anu Ramamurthy, Associate Research Fellow from Microchip Technology, and Open Chiplet Economy Sub-Project Co-Lead for Open Compute Project, explains:
- Large die sizes are reaching their physical limits, requiring division into smaller chiplets
- Chiplet architecture helps maintain high yields and lower costs while achieving needed computational power
- OCP enables multiple vendors to participate in the chiplet marketplace, expanding beyond proprietary solutions
Related Chiplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related Videos
- Unleashing Chiplet potential with BoW - "The Knot That Ties Chiplets Together"
- Getting Moore with Less: How Chiplets and Open Interconnect Accelerate Cloud-Optimized AI Silicon
- Chiplets tackle semiconductor barriers
- Rapid Innovation with Chiplets and FPGAs