After TSMC fab in Japan, advanced packaging facility is next
By Majeed Ahmad, EDN (March 18, 2024)
Japan’s efforts to reboot its chip industry are likely to get another boost: an advanced packaging facility set up by TSMC. That seems a logical expansion to TSMC’s $7 billion front-end chip manufacturing fab built in Kumamoto on Japan’s southern island Kyushu.
In other words, a back-end packaging facility will follow the front-end fab to complement the chip manufacturing ecosystem in Japan amid considerations to diversify semiconductor supply chains beyond Taiwan due to geopolitical tensions. Trade media has been abuzz about TSMC setting up an advanced packaging plant and a new Reuters report supports this premise.
To read the full article, click here
Related Chiplet
- Direct Chiplet Interface
- HBM3e Advanced-packaging chiplet for all workloads
- UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
- UCIe based 8-bit 48-Gsps Transceiver
- UCIe based 12-bit 12-Gsps Transceiver
Related News
- Silicon Box Accelerates Industry Leadership With Production Commencement at its World Leading Advanced Packaging Facility and Series B Fundraising
- SK hynix Signs Preliminary Memorandum of Terms with U.S. Department of Commerce for Advanced Packaging Facility in Indiana
- Amkor and TSMC to Expand Partnership and Collaborate on Advanced Packaging in Arizona
- Silicon Box welcomes European Commission approval of €1.3 billion Italian State aid measure to support new advanced packaging facility in Novara
Latest News
- Arm Chiplet System Architecture Makes New Strides in Accelerating the Evolution of Silicon
- Numem Overcomes AI Performance Barriers with Next-Gen Memory Solutions, Highlights Innovations at Chiplet Summit
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- YorChip announces patent-pending Universal PHY for Open Chiplets