Silicon Box to build €3.2 billion Italian chiplet factory
By Peter Clarke, eeNews Europe (March 11, 2024)
Singapore startup Silicon Box Pte. Ltd. will spend €3.2 billion (about US$3.5 billion) building a chiplet packaging factory in northern Italy, newswires quote Industry Minister Adolfo Urso saying Monday morning.
The plant is expected to create 1,600 jobs when operating at full capacity.
The minister did not expound on how large a subsidy the authorities would provide or where the money would come from. Nor was the location of the plant given.
“Recent global upheavals highlight the need to build a more resilient supply chain for semiconductors in Europe,” Urso is quoted saying by Bloomberg and Reuters.
To read the full article, click here
Related Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Interconnect Chiplet
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- Silicon Box selects Piedmont to host €3.2B chip foundry for Italian expansion
- Silicon Box welcomes European Commission approval of €1.3 billion Italian State aid measure to support new advanced packaging facility in Novara
- TDK Ventures invests in Silicon Box and its revolutionary chiplet technology
- Silicon Box Accelerates Industry Leadership With Production Commencement at its World Leading Advanced Packaging Facility and Series B Fundraising
Latest News
- Arm Reportedly Weighs Chiplet and Solution Development, Raising Customer Tensions
- SiMa.ai Expands Strategic Collaboration with Synopsys to Accelerate Automotive AI Innovation
- When Standards Enable Chiplets
- Multibeam Secures $31 Million in Series B Financing to Accelerate Global Deployment of E-Beam Lithography Production Solutions
- Alphawave Semi Highlights Why the Next Generation of AI Advances Demand Chiplet Architectures at EE Times: The Future of Chiplets