Silicon Box to build €3.2 billion Italian chiplet factory
By Peter Clarke, eeNews Europe (March 11, 2024)
Singapore startup Silicon Box Pte. Ltd. will spend €3.2 billion (about US$3.5 billion) building a chiplet packaging factory in northern Italy, newswires quote Industry Minister Adolfo Urso saying Monday morning.
The plant is expected to create 1,600 jobs when operating at full capacity.
The minister did not expound on how large a subsidy the authorities would provide or where the money would come from. Nor was the location of the plant given.
“Recent global upheavals highlight the need to build a more resilient supply chain for semiconductors in Europe,” Urso is quoted saying by Bloomberg and Reuters.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- Silicon Box selects Piedmont to host €3.2B chip foundry for Italian expansion
- Silicon Box welcomes European Commission approval of €1.3 billion Italian State aid measure to support new advanced packaging facility in Novara
- GlobalFoundries, Infineon, Silicon Box, STATS ChipPAC, TIER IV Join imec Automotive Chiplet Program
- TDK Ventures invests in Silicon Box and its revolutionary chiplet technology
Latest News
- Adeia Enters into Multi-Year IP License Agreement with AMD
- STMicroelectronics enters high-volume production of its industry-leading silicon photonics platform to support AI infrastructure demand
- Vertical Compute raises €57M to solve the AI memory bottleneck with new high density memory
- Ayar Labs Closes $500M Series E, Accelerates Volume Production of Co-Packaged Optics
- NanoIC opens access to first-ever fine-pitch RDL and D2W hybrid bonding interconnect PDKs