Silicon Box’s Business Head on how chiplet architecture transforms semiconductor scalability
By Sainul Abudheen K, e27 (January 29, 2024)
In a detailed interview, Silicon Box's Head discusses how chiplet architecture transforms semiconductor scalability, fosters industry collaboration, and fuels global expansion
Singapore-based Silicon Box enables chiplet architecture, allowing chip designers freedom from the constraints of a single, monolithic chip for processing. By leveraging multiple smaller chips interconnected in a single package, chip designers can create the equivalent of a system-on-a-chip (SoC) in a package.
The company recently raised US$200 million in Series B funding from BRV Capital, Event Horizon Capital, Maverick Capital, and others, intending to reshape the semiconductor landscape. The capital will primarily go into expanding production in its US$2-billion packaging factory in Singapore.
In this interview with e27, Michael Han, Silicon Box’s Head of Business, discusses the impact of capital injection on factory expansion and the opportunities and challenges of the company.
Related Chiplet
- Direct Chiplet Interface
- HBM3e Advanced-packaging chiplet for all workloads
- UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
- UCIe based 8-bit 48-Gsps Transceiver
- UCIe based 12-bit 12-Gsps Transceiver
Related News
- Silicon Box breaks bottleneck in chiplet packaging with sub-5-micron technology
- Silicon Box to build €3.2 billion Italian chiplet factory
- Tata Electronics bets big on Singapore-based semiconductor co Silicon Box
- Empower Semiconductor to Present at Chiplet Summit 2024 on Eliminating External Regulators in Chiplet Architectures
Latest News
- CHIPS for America Announces up to $300 million in Funding to Boost U.S. Semiconductor Packaging
- Scintil Photonics names Matt Crowley as CEO, founder Sylvie Menezo will continue heading technology developments and customer partnerships
- TSMC drives A16, 3D process technology
- Eliyan Ports Industry’s Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- GlobalFoundries and U.S. Department of Commerce Announce Award Agreement on CHIPS Act Funding for Essential Chip Manufacturing