Overcoming Chiplet Integration Challenges With Adaptability
The evolution of chiplets is realizing real-world integration problems that can be mitigated with adaptable solutions provided by embedded programmable logic.
By Jayson Bethurem, Flex Logix (May 9, 2024)
Chiplets are exploding in popularity due to key benefits such as lower cost, lower power, higher performance and greater flexibility to meet specific market requirements. More importantly, chiplets can reduce time-to-market, thus decreasing time-to-revenue! Heterogeneous and modular SoC design can accelerate innovation and adaptation for many companies. What’s not to like about chiplets? Well, as chiplets come to fruition, we are starting to realize many of the complications of chiplet designs.
To read the full article, click here
Related Chiplet
Related News
- Imec achieves seamless InP Chiplet integration on 300mm RF Silicon Interposer with excellent performance at 140GHz
- DreamBig Semiconductor Announces Partnership with Samsung Foundry to Launch Chiplets for World Leading MARS Chiplet Platform on 4nm FinFET Process Technology Featuring 3D HBM Integration to Solve Scale-up and Scale-out Limitations of AI for the Masses
- PseudolithIC Inc. Raises $6M in Seed Funding to Revolutionize Wireless Chips with Proprietary Chiplet Heterogeneous Integration Technology
- The Basics of Chiplet Integration and Importance of Adhesive Solutions
Latest News
- Advanced Chip Packaging Tools Are New Battleground in India
- Lam Research and JSR Corporation/Inpria Corporation Enter Cross-Licensing, Collaboration Agreement to Advance Semiconductor Manufacturing
- Socionext and imec Update Core Partner Program
- TCS Unveils Chiplet-Based System Engineering Services to Accelerate Semiconductor Innovation
- Deca and Silicon Storage Technology Announce Strategic Collaboration to Enable NVM Chiplet Solutions