Hybrid Bonding Makes Strides Toward Manufacturability
Companies are selecting preferred flows, but the process details are changing rapidly to meet the needs of different applications.
By Laura Peters, SemiEngineering (October 28, 2024)
Hybrid bonding is gaining traction in advanced packaging because it offers the shortest vertical connection between dies of similar or different functionalities, as well as better thermal, electrical and reliability results.
Advantages include interconnect scaling to submicron pitches, high bandwidth, enhanced power efficiency, and better scaling relative to solder ball connections. But while some chipmakers do have hybrid bonding in high-volume manufacturing (HVM), the cost of the process is too high at present for mass adoption. And because hybrid bonding pulls together front-end and back-end lines, assembly processes such as die placement now must meet front-end specifications.
To read the full article, click here
Related Chiplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- Adeia Demonstrates Hybrid Bonding Technology During Chiplet Summit 2024
- Adeia Presents Metrology Techniques for Improved Yield in Hybrid Bonding at IMAPS Device Packaging Conference 2024
- SEMI 3D & Systems Summit to Spotlight Trends in Hybrid Bonding, Chiplet Design and Environmental Sustainability
- EV Group Hybrid Bonding, Maskless Lithography and Layer Transfer Solutions for Heterogeneous Integration to be Highlighted at ECTC 2024
Latest News
- Advanced Chip Packaging Tools Are New Battleground in India
- Lam Research and JSR Corporation/Inpria Corporation Enter Cross-Licensing, Collaboration Agreement to Advance Semiconductor Manufacturing
- Socionext and imec Update Core Partner Program
- TCS Unveils Chiplet-Based System Engineering Services to Accelerate Semiconductor Innovation
- Deca and Silicon Storage Technology Announce Strategic Collaboration to Enable NVM Chiplet Solutions