Hybrid bonding: A global picture of the IP competition

SOPHIA ANTIPOLIS, France – September 09 2024  --  KnowMade, a leading provider of patent analysis services, is proud to announce the release of its latest report, Hybrid Bonding Patent Landscape Analysis 2024. This comprehensive report provides a detailed examination of the competitive landscape of the hybrid bonding technology from a patent perspective, offering critical insights for stakeholders and decision-makers.

A technological trend to watch

Hybrid bonding technology is rapidly evolving as a crucial process in advanced semiconductor packaging, driven by the increasing demands for higher interconnect density, faster signal transmission, and 3D heterogeneous integration. The Hybrid Bonding IP report thoroughly maps the patent landscape, identifying inventions related to hybrid bonding process and semiconductor devices made using hybrid bonding interconnects, and highlighting the key patent owners, the IP newcomers, and their strategic IP positions that could impact the future of the semiconductor packaging industry.

Key highlights of the report

• Patent Analysis: The report provides an evaluation of the global patent landscape related to hybrid bonding technology, encompassing patent filing trends, geographical distribution, and legal status.
• Competitive Intelligence: Identification and profiling of major IP players, including both established patent assignees and emerging patent applicants, revealing their R&D focus and strategic positioning.
• Technological Innovations: Insights into the latest technological advancements and innovative approaches in hybrid bonding, highlighting ongoing R&D efforts and potential future directions.
• Market Implications: Exploration of the potential impact of hybrid bonding patents for various applications, including memory, logic, RF, and photonics.
• Strategic Guidance: Actionable intelligence for industrials, enabling informed strategic decisions related to R&D investments, IP portfolio management, and competitive positioning.

Dr. Nicolas Baron, CEO of KnowMade, remarked, “In the rapidly evolving landscape of advanced semiconductor packaging, hybrid bonding stands out as a transformative technology. Our latest patent landscape analysis offers unparalleled clarity, empowering companies in semiconductor industry to navigate the complex IP landscape and align their strategies with emerging technological trajectories.”

The Hybrid Bonding Patent Landscape Analysis 2024 report is an essential resource for semiconductor companies, IP professionals, investors, and technology developers aiming to gain a competitive edge in the hybrid bonding domain.

About the author

Pauline Calka, PhD. works for KnowMade as a patent analyst in the fields of semiconductor manufacturing and advanced packaging. She holds a PhD in Memory from the University of Grenoble Alpes (France), in partnership with the CEA-Leti (France). After an Alexander von Humboldt Postdoc fellowship position at the Technical University of Berlin (Germany) and the Leibniz Institute for High Performance Microelectronics on ReRAM development, Pauline worked five years at ASM International (Belgium) as Senior Process Engineer on thin film development for logic, memory and MEMS, and two years at CEA-Leti as Integration Engineer on imaging CMOS sensors.

About KnowMade

KnowMade is a technology intelligence and IP strategy consulting company specialized in analyzing patents and scientific publications. The company helps innovative companies, investors, and R&D organizations to understand competitive landscape, follow technological evolutions, reduce uncertainties, and identify opportunities and risks in terms of technology and intellectual property.
KnowMade’s analysts combine their strong technology expertise and in-depth knowledge of patents with powerful analytics tools and methodologies to turn patent information and scientific literature into actionable insights, providing high added value reports for decision makers working in R&D, innovation strategy, intellectual property, and marketing. Our experts provide prior art search, patent landscape analysis, freedom-to-operate analysis, IP due diligence, and monitoring services.
KnowMade has a solid expertise in Compound Semiconductors, Power Electronics, Batteries, RF Technologies & Wireless Communications, Solid-State Lighting & Display, Photonics, Memories, MEMS & Sensors, Semiconductor Packaging, Medical Devices, Medical Imaging, Microfluidics, Biotechnology, Pharmaceutics, and Agri-Food.