Edge AI chiplet uses SemiDynamics RISC-V cores
By Nick Flaherty, eeNews Europe (January 19, 2024)

YorChip is developing a chiplet for edge AI applications using RISC-V cores from Semidynamics in Barcelona.
The edge AI chiplet will use the SemiDynamics Atrevido quad core RISC-V IP and the UCIe standard interface. The four Atrevido 423 cores provide 10 Int8-TOPS per chiplet in a target technology of 12nm and a target die size under 25mm2.
SemiDynamics in Barcelona has developed series of configurable RISC-V vector processors for automotive, robotic, drones and other high-performance edge AI markets. YorChip is a Silicon Valley start-up aiming to developing a complete ecosystem of off the shelf focused on chiplets using proven partner IP and a novel die-to-die technology.
To read the full article, click here
Related Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
Related News
- YorChip, Inc. announces its first Chiplet for Edge AI applications with IP licensed from Semidynamics, the leader in RISC-V IP based in Barcelona
- Ambiq and Bravechip Cut Smart Ring Costs by 85% with New Edge AI Chiplet
- EdgeCortix Unveils RAIDEN, a Scalable, Energy-Efficient AI Chiplet Platform Purpose-Built for Physical AI
- EDGE and Lockheed Martin to Collaborate on Advanced Chiplet Design Capabilities
Latest News
- Evatec delivers first CLUSTERLINE® 310 for Advanced Packaging on small panel formats
- Europe’s Advanced Packaging Gap: Fraunhofer, Swissbit Target the Missing Middle
- ZEISS strengthens advanced packaging portfolio with solutions for inline X-ray inspection and wafer warpage correction
- Microsoft to expand Azure Maia system to multi-gigawatt deployments
- Chiplets at the Edge: How Modular SoCs Redefine Performance Per Watt