Credo to Acquire Hyperlume, Inc.
Addition of MicroLED Technology Capabilities Accelerates Credo Leadership in High-Speed Connectivity
SAN JOSE, Calif.-- September 29, 2025 -- Credo Technology Group Holding Ltd (Credo) (NASDAQ: CRDO), an innovator in providing secure, high-speed connectivity solutions that deliver improved reliability and energy efficiency, today announced the closing of its acquisition of privately-held Hyperlume, Inc., a developer of MicroLED-based optical interconnect technology for chip-to-chip communication. This acquisition enables Credo to expand its comprehensive portfolio of end-to-end system-level connectivity solutions with Hyperlume’s cutting-edge miniature light-emitting diode (microLED) technology to address the future of AI-driven data infrastructure deployments.
The escalating bandwidth demands that large datasets and parallel processing place on networks are changing the way that data is transmitted in AI, cloud and hyperscale data centers. MicroLED technology is emerging as a next-generation optical technology for data center interconnects as it brings the high-speed, energy-efficiency and low-latency data transmission required for scaling massive AI clusters.
Hyperlume’s unique technology uses specialized, ultra-fast microLEDs and ultra-low power circuitry to overcome the energy and bandwidth bottlenecks inherent in traditional electronic interconnects. The addition of Hyperlume’s microLED technology into Credo’s portfolio offerings will provide customers with novel options for scaling up AI networks.
“The acquisition of Hyperlume extends our innovative system-level connectivity solutions that spans diverse physical mediums, distances, and protocols to deliver optimized solutions to meet each customer’s needs,” said Bill Brennan, president and CEO of Credo. “MicroLED technology aligns with our mission to innovate and advance high-speed connectivity by enabling faster, more reliable, more energy-efficient, and scalable solutions for the AI era. We welcome the Hyperlume team to Credo and look forward to creating a new class of connectivity solutions together.”
“We’re excited to become part of Credo, a company that shares our passion for redefining connectivity through bold innovation. Together, our aligned vision and commitment will accelerate breakthroughs shaping the future of high-performance infrastructure,” said Mohsen Asad, CEO at Hyperlume. “MicroLED technology is poised to help shape the future of computing — one that is more efficient and sustainable while bringing a new level of connectivity as AI models continue to scale. Today’s announcement is a leap forward in bringing this future closer.”
About Credo
Credo’s mission is to redefine high-speed connectivity by delivering breakthrough solutions that enable the next generation of AI-driven applications. We are committed to enabling faster, more reliable, more energy-efficient, and scalable solutions that support the ever-expanding demands of AI, cloud computing, and hyperscale networks. Our innovations ease system bandwidth bottlenecks while simultaneously improving on power, security, and reliability. Our connectivity solutions are optimized for optical and electrical Ethernet applications, including the emerging 100G (or Gigabits per second), 200G, 400G, 800G and the emerging 1.6T (or Terabits per second) port markets. Credo products are based on our proprietary Serializer/Deserializer (SerDes) and Digital Signal Processor (DSP) technologies. Our product families include Integrated Circuits (ICs) for the optical and line card markets, Active Electrical Cables (AECs) and SerDes Chiplets. Our intellectual property (IP) solutions consist primarily of SerDes IP licensing.
For more information, please visit https://www.credosemi.com.
Related Chiplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- Ayar Labs to Showcase Optical Interconnect Solutions to Redefine AI Infrastructure at OFC 2024
- Optical Chiplet Interconnect Promises to Accelerate Computing Apps
- Avicena Announces Modular LightBundle™ Optical Interconnect Platform with > 1Tbps/mm I/O density and < 1pJ/bit
- Celestial AI Introduces Photonic Fabric™ Module - World’s First SoC with In-Die Optical Interconnect, Ushering in a New Era of Interconnects
Latest News
- YES Receives Multiple VeroTherm™ and VeroFlex™ System Orders from Leading Memory Supplier
- Rebellions Raises $250 Million to Advance the Next Generation AI Infrastructure, Backed by Arm and Samsung
- Credo to Acquire Hyperlume, Inc.
- GlobalFoundries and Corning Collaborate To Deliver Detachable Fiber Connector Solutions to Scale Next-Generation Optical Connectivity
- Avicena Demonstrates Breakthrough Ultra-Low Power microLED Link at 200fJ/bit Tx Power