Chiplet Makers Expect to Disrupt Incumbents
By Alan Patterson, EETimes (January 16, 2024)
Executives at chip startups Tenstorrent and Alphawave foresee a day when their firms’ sales of chiplets and IP erodes the business of incumbent chip vendors like Qualcomm.
An SoC customer must buy graphics, image signal processing, media, application processing, Arm cores, a modem and security all in one chip, Tenstorrent COO Keith Witek told EE Times, noting that chiplets allow more choices.
“With chiplets, you can say, ‘I don’t want to get $130 of my solution from Qualcomm.’ In fact, somebody might say, ‘I only think their modem is good. The rest of the stuff I can get from a different chip’.” Witek emphasized that he gave Qualcomm as an example only.
Designers Alphawave and Tenstorrent expect chiplets to sell like commodities in a marketplace. That remains only an expectation.
To read the full article, click here
Related Chiplet
- Automotive AI Accelerator
- Direct Chiplet Interface
- HBM3e Advanced-packaging chiplet for all workloads
- UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
- UCIe based 8-bit 48-Gsps Transceiver
Related News
- Rapidus and IBM Expand Collaboration to Chiplet Packaging Technology for 2nm-Generation Semiconductors
- Polar Bear Tech secures new funding to develop first independent chiplet product library
- Baya Systems and Blue Cheetah Partner to Deliver Chiplet Interconnect Solutions
- ASMPT and IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI
Latest News
- Brewer Science to Present Temporary Bonding Materials for Chiplet Integration at 2025 Critical Materials Council (CMC) Conference
- Tokyo Electron and IBM Renew Collaboration for Advanced Semiconductor Technology
- Benefits And Challenges In Multi-Die Assemblies
- NEDO Approves Rapidus’ FY2025 Plan and Budget for 2nm Semiconductor Projects
- Lightmatter Announces Passage L200, the Fastest Co-Packaged Optics for AI