Benefits And Challenges In Multi-Die Assemblies
What makes advanced packaging so attractive to some companies and not others.
By Ed Sperling And Laura Peters, SemiEngineering | April 2nd, 2025
Semiconductor Engineering sat down to discuss chiplets, hybrid bonding, and new materials with Michael Kelly, vice president of Chiplets and FCBGA Integration at Amkor; William Chen, fellow at ASE; Dick Otte, CEO of Promex Industries; and Sander Roosendaal, R&D director at Synopsys Photonics Solutions. What follows are excerpts of that discussion.
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