Benefits And Challenges In Multi-Die Assemblies
What makes advanced packaging so attractive to some companies and not others.
By Ed Sperling And Laura Peters, SemiEngineering | April 2nd, 2025
Semiconductor Engineering sat down to discuss chiplets, hybrid bonding, and new materials with Michael Kelly, vice president of Chiplets and FCBGA Integration at Amkor; William Chen, fellow at ASE; Dick Otte, CEO of Promex Industries; and Sander Roosendaal, R&D director at Synopsys Photonics Solutions. What follows are excerpts of that discussion.
To read the full article, click here
Related Chiplet
- Optical Chiplet
- Reverse Gearbox Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
Related News
- Geometry Challenges in Multidie Thermal Management
- Challenges In Managing Chiplet Resources
- Multi-Die Assemblies Complicate Parasitic Extraction
- Distributing Intelligence Inside Multi-Die Assemblies
Latest News
- Building Out Advanced Packaging Portfolio, JCET Delivers Steady Revenue Growth and Improved Profitability in Q3 YTD 2026
- Egis Group and SiPearl Sign Strategic Cooperation and Investment Agreements to Expand Opportunities on a Global Scale
- Unigen Expands AI Module and Server Compute Collaboration to EdgeCortix RAIDEN Platform
- Amkor Technology and NVIDIA Advance Strategic Partnership for AI Infrastructure
- Siemens expands agentic AI collaboration to tackle 3D IC power and thermal challenges with NVIDIA