Benefits And Challenges In Multi-Die Assemblies
What makes advanced packaging so attractive to some companies and not others.
By Ed Sperling And Laura Peters, SemiEngineering | April 2nd, 2025
Semiconductor Engineering sat down to discuss chiplets, hybrid bonding, and new materials with Michael Kelly, vice president of Chiplets and FCBGA Integration at Amkor; William Chen, fellow at ASE; Dick Otte, CEO of Promex Industries; and Sander Roosendaal, R&D director at Synopsys Photonics Solutions. What follows are excerpts of that discussion.
To read the full article, click here
Related Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Interconnect Chiplet
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- What’s next for multi-die systems in 2024?
- Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design
- Amkor and TSMC to Expand Partnership and Collaborate on Advanced Packaging in Arizona
- Faraday and Kiwimoore Succeed in 2.5D Packaging Project for Mass Production
Latest News
- AI Pushes High-End Mobile From SoCs To Multi-Die
- Infinitesima Metron®3D 300mm System Released for In-line Process Control by Leading DRAM Manufacturer
- Tenstorrent’s Blue Cheetah deal a harbinger of chiplet acquisition spree
- Tenstorrent Acquires Blue Cheetah Analog Design
- Silicon Box Celebrates Fourth Anniversary with Rapid Growth, New Milestones