Arm bids for chiplet dominance
By Nick Flaherty, eeNews Europe (February 14, 2024)

ARM has launched two programmes to boost is position in chiplet designs around cores and interconnect.
ARM cites the need for a common framework that requires significant and focused collaboration with the ARM Chiplet System Architecture (CSA) and a new version of the CHI interconnect.
The chiplet system architecture brings together 20 partners to analyze and define the optimal partitioning choices for chiplet-based systems. The goal is to develop the CSA to allow greater reuse of components between multiple suppliers. The partners range from mobile to automotive to infrastructure including how to partition an ARM-based system across multiple chiplets, or the high-level properties such as requirements for system memory or a Root of Trust.
To read the full article, click here
Related Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
Related News
- Arm Reportedly Weighs Chiplet and Solution Development, Raising Customer Tensions
- AMI Launches Developer Program for Arm Total Design to Rapidly Accelerate Arm-based Chiplet Development
- AMI Introduces New Management Platform Arm Neoverse CSS Chiplet
- Eliyan joins Arm Total Design ecosystem to accelerate chiplet economy
Latest News
- Arteris Accelerates Industry Transition to Multi-Die Chiplet-Based Architecture
- Fujitsu launches made-in-Japan next-generation CPU FUJITSU-MONAKA and Fujitsu MONAKA Server for sovereign AI infrastructure
- Signaloid joins Open Chiplet Atlas Alliance and Announces Plans to Make Its UxHw ASICs Available via OCA Ecosystem
- Lorentz Solution Jointly Presents with NVIDIA on Automated Large-Scale Chip-Level 3D EM Extraction and Sign-off of Ultra-High-Speed Silicon Photonics and IC/3DIC Designs at 2026 TSMC OIP
- Alchip Technologies Showcases Advanced ASIC Design and Packaging at AI Infra Summit 2026