AI Pushes High-End Mobile From SoCs To Multi-Die
Smart phone architectures look very different at the high end versus midrange and low-end devices.
By Liz Allan, Semi Engineering | July 8th, 2025
Advanced packaging is becoming a key differentiator for the high end of the mobile phone market, enabling higher performance, more flexibility, and faster time to market than systems on chip.
Monolithic SoCs likely will remain the technology of choice for low-end and midrange mobile devices because of their form factor, proven record, and lower cost. But multi-die assemblies provide more flexibility, which is essential for AI inferencing and keeping up to date with rapid changes in AI models and communications standards. Ultimately, OEMs and chipmakers must decide the best way to accommodate changes in a design cycle and which market segments to target.
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