Is a GPU, ASIC or chiplet-based SoC better for AI as we switch from training to inference?
Over the past decade, GPUs became fundamental to the progress of artificial intelligence (AI) and machine learning (ML). They are widely used to handle large-scale computations required in AI model training and inference, and are playing an increasingly important role in data centers. The key feature of the GPU is its ability to perform parallel processing efficiently, making it ideal for training machine learning models, which require numerous computations to be carried out simultaneously.
However, as the demand for AI computing increases, the overall efficiency of this technology is being called into question. Industry data suggests that roughly 40% of time is spent in networking between compute chips across a variety of workloads, bottlenecked by limited communication capacity (fig. 1).
The demand for AI applications continues to rise and this connectivity issue comes at the same time as the costs of general-purpose GPUs for specific workloads and their high power consumption are motivating a move away from GPU-centric compute architectures, towards custom silicon and chiplet-based designs. These modular and flexible SoCs enable scalable hardware solutions that can be optimized not only to reduce power consumption, and cost but improve communication bandwidth too.
Related Chiplet
- Direct Chiplet Interface
- HBM3e Advanced-packaging chiplet for all workloads
- UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
- UCIe based 8-bit 48-Gsps Transceiver
- UCIe based 12-bit 12-Gsps Transceiver
Related Blogs
- Alphawave Semi Bridges from Theory to Reality in Chiplet-Based AI
- Switchboard: An Open Source High-Performance Communication Platform
- Synopsys and Intel Team Up on the First UCIe-Connected Chiplet-Based Test Chip
- Revolutionizing Automotive Design with Chiplet-Based Architecture
Latest Blogs
- Scaling AI Data Centers: The Role of Chiplets and Connectivity
- Is a GPU, ASIC or chiplet-based SoC better for AI as we switch from training to inference?
- Siemens EDA intros next-gen ESD; focus on chiplet-design kits (CDK)
- Accelerating the AI Economy through Heterogeneous Integration
- Outlook 2025: Embracing Chiplets