Chiplet Ecosystem - Package
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IBMRead more
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SK HynixSK hynix Inc., headquartered in Korea, is the world’s top tier semiconductor supplier offering Dynamic Random Access Memory chips (“DRAM”), flash memory chips (“NAND flash”) and...Read more
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Advanced Semiconductor Engineering, Inc. (ASE)ASE is a primary architect of Heterogeneous Integration (HI) - the technology that integrates separately manufactured components into a higher level assembly (System-in-Package or SiP) that in the aggregate...Read more
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AdeiaAdeia is a leading R&D and intellectual property (IP) licensing company that accelerates the adoption of innovative technologies in the media and semiconductor industries. Adeia’s fundamental...Read more
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Sarcina TechnologyFounded in 2011, Sarcina Technology is the Application Specific Advanced Packaging Service that provides a boutique collaborative experience for small-to-mid-sized IC companies. It brings a proven...Read more
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Deca TechnologiesDeca is the leading independent provider of advanced packaging technology to the semiconductor industry. Our M-Series™ technology is the industry’s highest volume fan-out, powering the world’s...Read more
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Silicon BoxSilicon Box is an advanced semiconductor integration service provider, specialising in cutting-edge integration technology. We are capable of delivering full execution, from initial design to final manufacturing...Read more
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EV GroupEV Group (EVG) is a leading supplier of high-volume production equipment and process solutions for the manufacture of semiconductors, MEMS, compound semiconductors, power devices and nanotechnology devices. A...Read more
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Chipletz, Inc.Chipletz, incorporated in 2021, offers Smart Substrate™ products, an advanced packaging technology that addresses the increasing demand for compute performance as Moore's Law slows down. Targeting...Read more
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