2.5D Integration

2.5D Integration is an advanced semiconductor packaging technique that places multiple chips or chiplets side-by-side on a high-performance interposer, allowing them to communicate at extremely high speeds. It’s called “2.5D” because it offers many of the benefits of full 3D stacking—such as high bandwidth and lower power—without requiring chips to be stacked directly on top of each other.

In simple terms, 2.5D Integration is like placing several powerful chips on one ultra-fast “circuit board” made of silicon or other materials, enabling them to work together as a unified system.

Related Articles

• ReVolt: Power Delivery Network-Aware Voltage Droop Control for 2.5D PIM Chiplet Architectures
• Thermo-mechanical reliability evaluation and comparative fatigue assessment of 2.5D chiplet packages with viscoelastic C4 underfill
• FAPlace: Joint Optimization of Chiplet Placement and Interposer Footprint for 2.5D Systems
• 2.5D Root of Trust: Securing the Chiplet Ecosystem
• CLIPGen: A Chiplet Link IP Modeling and Generation Framework for 2.5D Architecture Exploration

Related Blogs

• 2.5D vs 3D-IC: Architecture Tradeoffs, and a Practical Selection

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