YorChip predicts 2026 will be the year of the chiplet
By Caroline Hayes, ElectronicsWeekly (July 3, 2024)
Nearly a year after announcing its strategic partnership with FPGA developer QuickLogic to produce FPGA chiplets, YorChip elaborated on its plans to apply chiplets to more general-purpose applications.
Start-up YorChip specialises in UCIe-compatible IP. Last August the company announced a partnership with FPGA provider QuickLogic to collaborate in developing FPGA chiplets optimised for low power consumption and low cost.
To read the full article, click here
Related Chiplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- YorChip and Digitho developing breakthrough 2D Chiplet Packaging for Mass Markets
- European Chiplet Innovation: APECS Pilot Line starts Operation in the Framework of the EU Chips Act
- DreamBig Semiconductor Announces Partnership with Samsung Foundry to Launch Chiplets for World Leading MARS Chiplet Platform on 4nm FinFET Process Technology Featuring 3D HBM Integration to Solve Scale-up and Scale-out Limitations of AI for the Masses
- YorChip and ChipCraft announce low-cost, high-speed 200Ms/s ADC Chiplet
Latest News
- Chiplet-Based Solutions Accelerate the Development of Embedded NVM
- Veeco Announces Multiple Orders for Wet Processing and Lithography Systems to Support Advanced Packaging and Silicon Photonics at a Leading Semiconductor Foundry
- Socionext Unveils "Flexlets™", a Configurable Chiplet Ecosystem to Accelerate Multi-die Silicon Innovation
- BOS Semiconductors and Tenstorrent Partner to Build an Open Chiplet Ecosystem
- Astera Labs to Acquire aiXscale Photonics