YorChip predicts 2026 will be the year of the chiplet
By Caroline Hayes, ElectronicsWeekly (July 3, 2024)
Nearly a year after announcing its strategic partnership with FPGA developer QuickLogic to produce FPGA chiplets, YorChip elaborated on its plans to apply chiplets to more general-purpose applications.
Start-up YorChip specialises in UCIe-compatible IP. Last August the company announced a partnership with FPGA provider QuickLogic to collaborate in developing FPGA chiplets optimised for low power consumption and low cost.
To read the full article, click here
Related Chiplet
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
- HBM3e Advanced-packaging chiplet for all workloads
- UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
Related News
- Manufacturers Anticipate Completion of NVIDIA's HBM3e Verification by 1Q24; HBM4 Expected to Launch in 2026
- JEDEC Announces New Release of JEP30 Part Model Guidelines, Empowering Chiplet Integration
- YorChip announces Low Latency 200G Chiplet for edge AI
- System-level UCIe IP for early architecture analysis of 3D Chiplet Design and Packaging
Latest News
- Secafy Licenses Menta's eFPGA IP to Power Chiplet-Based Secure Semiconductor Designs
- EV Group Hybrid Bonding, Maskless Lithography and Layer Transfer Solutions for Heterogeneous Integration to be Highlighted at ECTC 2025
- Avicena Announces Series B Funding Round Led by Tiger Global with Participation from SK hynix
- Intel Unveils Chiplet Alliance To Enable New Chip Designs
- Top 10 OSAT Companies of 2024 Revealed—China Players See Double-Digit Growth, Reshaping the Global Market Landscape, Says TrendForce