TSMC plans automotive chiplet process for 2025
By Nick Flaherty, eeNews Europe (May 15, 2024)
TSMC is planning automotive qualified versions of its 3D fabric chiplet technology by the end of 2025.
The InFO-oS fanout technology will support multiple SoC devices on a substrate, with the first automotive chiplet process design kit (PDK) towards the end of this year and the full PDK early in 2026.
The CoWoS-R process will support SOCs with high performance HBM memory via an interposer to the substrate. The initial PDK will be available shortly with the full PDK similarly early in 2026.
To read the full article, click here
Related Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
Related News
- Chiplet Pioneer Eliyan Achieves First Silicon in Record Time with Implementation in TSMC 5nm Process, Confirms Most Efficient Chiplet Interconnect Solution in the Multi-Die Era
- Renesas Unveils Industry’s First Automotive Multi-Domain SoC Built with 3-nm Process Technology with Chiplet Extensions
- TSMC drives A16, 3D process technology
- Automotive Chiplet Ecosystem Heralds Agility and Flexibility
Latest News
- SMART Photonics Partners with GlobalFoundries to Offer Industry’s First Open Access Foundry Service for Integrated Silicon and Indium Phosphide Photonics Products
- OpenLight Adds Former GlobalFoundries Silicon Photonics Leader Kevin Soukup and Semiconductor Veteran Kirk Ouellette to Executive Team
- Marvell to Showcase Industry-First 2nm Optical Technology Demos for AI Data Center Infrastructure at ECOC 2026
- AI Chip Packaging Pushes Beyond Reticle Limits, with CoWoS-L Set to Remain the Mainstream Advanced Packaging Solution Through 2028
- onsemi Introduces the Embedded Power Platform, a Breakthrough Architecture for the AI Era