TSMC plans automotive chiplet process for 2025
By Nick Flaherty, eeNews Europe (May 15, 2024)
TSMC is planning automotive qualified versions of its 3D fabric chiplet technology by the end of 2025.
The InFO-oS fanout technology will support multiple SoC devices on a substrate, with the first automotive chiplet process design kit (PDK) towards the end of this year and the full PDK early in 2026.
The CoWoS-R process will support SOCs with high performance HBM memory via an interposer to the substrate. The initial PDK will be available shortly with the full PDK similarly early in 2026.
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