TSMC plans automotive chiplet process for 2025
By Nick Flaherty, eeNews Europe (May 15, 2024)
TSMC is planning automotive qualified versions of its 3D fabric chiplet technology by the end of 2025.
The InFO-oS fanout technology will support multiple SoC devices on a substrate, with the first automotive chiplet process design kit (PDK) towards the end of this year and the full PDK early in 2026.
The CoWoS-R process will support SOCs with high performance HBM memory via an interposer to the substrate. The initial PDK will be available shortly with the full PDK similarly early in 2026.
To read the full article, click here
Related Chiplet
- Automotive AI Accelerator
- Direct Chiplet Interface
- HBM3e Advanced-packaging chiplet for all workloads
- UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
- UCIe based 8-bit 48-Gsps Transceiver
Related News
- Renesas Unveils Industry’s First Automotive Multi-Domain SoC Built with 3-nm Process Technology with Chiplet Extensions
- Chiplet Pioneer Eliyan Achieves First Silicon in Record Time with Implementation in TSMC 5nm Process, Confirms Most Efficient Chiplet Interconnect Solution in the Multi-Die Era
- Eliyan Delivers Industry’s Highest Performing Chiplet Interconnect PHY at 64Gbps in 3nm Process
- Arm, ASE, BMW Group, Bosch, Cadence, Siemens, SiliconAuto, Synopsys, Tenstorrent and Valeo commit to join imec’s Automotive Chiplet Program
Latest News
- Major Advancement in Applied Research: FMD Launches the Chiplet Application Hub
- Baden-Württemberg attracts imec to lead development of chiplet-based technology for automotive applications
- Marvell Demonstrates Silicon Photonics Light Engine for Low-power, Rack-scale Interconnect in AI Networks
- Ranovus® announces collaboration with Jabil® for mass production of ODIN® optical engine
- Ayar Labs Unveils World's First UCIe Optical Chiplet for AI Scale-Up Architectures