The Evolution of Interconnects in Microelectronics Packaging

By Dr. Dongkai Shangguan
3DIncites (November 14, 2024)

Semiconductor packaging is a complex and evolving field, involving multiple disciplines. As a microelectronics packaging engineer, I focus on the “interconnect thread” from the chip to the system (Figure 1).

To me, packaging is about interconnectivity (essentially). The primary function of packaging is to provide the interconnection from the IC to the system, for signal distribution and power distribution. What makes it more complex (and thus interesting) is the enabling functions, including mechanical reliability (especially under complex loading conditions in diverse use environments – thus various failure modes and mechanisms); thermal dissipation (especially important for high power and also due to the multiple interfaces in the system); as well as manufacturability that has to be considered (such as low temperature soldering, fine pitch processes, cost and quality, and very importantly, sustainability). These electro-mechano-thermal functions of the interconnect are what makes “packaging” such a critical area for semiconductor technology today. In the age of heterogeneous integration, a variety of interconnects in the same package have to be considered.

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