Expanding the Chiplet Market: Processing Any Wafer from Any Foundry
By Sylvie Joly, 3D InCites (July 30, 2024)
In response to the rising costs of advanced nodes and the slowdown of Moore’s Law, major vendors – AMD, Intel, Apple, and Samsung – are making the shift towards chiplet-based systems using 3D technologies, which create novel system partitioning through modular and scalable architectures. These solutions optimize bandwidth with respect to power consumption, contributing to the current energy-sober trend. The very short interconnects in chiplets also reduce data transfer latency. However, the unprecedented growth of artificial intelligence (AI) applications creates new and significant energy demands. Consequently, advanced packaging ecosystems are needed to deliver faster and more cost-effective systems with ever-greater functionality, performance, and power efficiency.
The Chiplet Market
By 2028, chiplets are projected to be almost ubiquitous in high-end data centers housing generative AI and computational processors (Figure 1), and needs are emerging in the consumer and automotive markets. For example, 3D integrations are already included in some high-end consumer products such as imagers (from Sony or STMicroelectronics), where they optimize the power, performance, area, and cost (PPAC) trade-off.
To read the full article, click here
Related Chiplet
- Direct Chiplet Interface
- HBM3e Advanced-packaging chiplet for all workloads
- UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
- UCIe based 8-bit 48-Gsps Transceiver
- UCIe based 12-bit 12-Gsps Transceiver
Related News
- Silicon Catalyst at the Chiplet Summit: Presentation, Panel and Exhibition
- The Emergence of the Chiplet Economy with Alphawave Semi’s Letizia Guiliano
- Tenstorrent RISC-V and Chiplet Technology Selected to Build the Future of AI in Japan
- Innovation in the semiconductor market: chiplets pave the way to the future
Latest News
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
- Silicon Box welcomes European Commission approval of €1.3 billion Italian State aid measure to support new advanced packaging facility in Novara
- Fraunhofer IMS Takes a Key Role in Establishing the APECS Pilot Line
- EdgeCortix Joins AI-RAN Alliance to Accelerate the Integration of AI and Next-gen RAN Infrastructure
- Cadence Rolls Out System Chiplet to Reorganize the SoC