Die-to-die Interconnect Standards In Flux

Many features of UCIe 2.0 seen as “heavy” are optional, causing confusion.

By  Bryon Moyer, SemiEngineering | May 15, 2025

UCIe, a standard for die-to-die interconnect in advanced packages, has drawn concern about being too heavyweight with its 2.0 release. But the fact that many of the new features are optional seems to have been lost in much of the public discussion.

In fact, new capabilities that support a possible future chiplet marketplace are not required for designs that don’t target that marketplace.

“It’s the blessing and the curse of UCIe,” said Mick Posner, senior product marketing group director at Cadence. “The spec is defined with so many variants that you can tailor it to your exact needs. It’s applicable for everything from automotive to high-performance compute to AI to mil/aero because it has so many flavors. That’s also a curse to an IP provider. How do you support all those flavors?”

To read the full article, click here