Chiplet Summit 2024 Focuses on Accelerating Generative AI
SAN DIEGO -- December 04, 2023----Generative AI is today’s biggest technology news, and Chiplet Summit is therefore making it the focus of the 2024 event at the Santa Clara Convention Center on February 6-8. The Tuesday superpanel features leading experts expressing their views on "How Can Chiplets Accelerate Generative AI?". The Wednesday plenary has Palo Alto Electron CEO Jawad Nasrullah presenting "Developing Chips for Tomorrow: You, Me, and ChatGPT®". A Thursday session offers an annual update on generative AI applications.
The Summit also offers major company keynotes, tutorials, panels, and paper sessions on subjects ranging from optimization to industry trends. An exhibit hall has key products from industry leaders.
"Chiplet Summit will help designers meet Generative AI’s challenges," said Chuck Sobey, Summit General Chair. "We invite everyone in the ecosystem to come learn about new technologies, discuss issues face-to-face, and set the direction for the industry."
To discuss exhibiting, contact:
Elizabeth Leventhal, Exhibit Sales Director
Elizabeth@ChipletSummit.com
+1.760.809.5755
About Chiplet Summit
Chiplet Summit, produced by Semper Technologies, showcases the mainstream applications, key technologies, and leading vendors that are driving the rapidly expanding chiplet market.
To learn more about the Summit, visit https://chipletsummit.com.
Related Chiplet
- Automotive AI Accelerator
- Direct Chiplet Interface
- HBM3e Advanced-packaging chiplet for all workloads
- UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
- UCIe based 8-bit 48-Gsps Transceiver
Related News
- Alphawave Semi ‘Redefines Connectivity’ in AI Hardware and Edge AI Summit 2024 Presentation on Chiplet Interconnects
- Chiplet Summit to Focus on New Packages and AI Applications in 2025
- Chiplet Summit Announces Its Initial Keynote Schedule With Emphasis on AI Applications
- Empower Semiconductor to Present at Chiplet Summit 2024 on Eliminating External Regulators in Chiplet Architectures
Latest News
- Benefits And Challenges In Multi-Die Assemblies
- NEDO Approves Rapidus’ FY2025 Plan and Budget for 2nm Semiconductor Projects
- Lightmatter Announces Passage L200, the Fastest Co-Packaged Optics for AI
- Alphawave Semi brings High-Speed Connectivity and Compute Solutions at OFC 2025
- Major Advancement in Applied Research: FMD Launches the Chiplet Application Hub