Arteris Builds on Growth With Product Launches, Strategic Licensing Agreements

CAMPBELL, Calif. – September 3, 2025 – In a market fueled by the compute demands of AI, Arteris, Inc. (Nasdaq: AIP), a leading provider of system IP for accelerating chiplet and system-on-chip (SoC) creation, will attend the AI Infra Summit 2025 on the heels of strong Q2 earnings and a string of high-profile announcements. The sweeping expansions to Arteris’ Multi-Die solution, the release of Magillem Packaging software, and the multiple customer announcements, including a licensing agreement with AMD for the new FlexGen interconnect IP, place Arteris at the forefront of innovation as the need for optimized silicon design becomes more pressing than ever.

FlexGen smart NoC IP technology from Arteris, continues to establish itself as a new standard in efficiency for both engineering and chip/chiplet power consumption. It utilizes automation to design the interconnect and minimizes manual adjustments. It accelerates chip design by 10x, reducing design risk and slashing iterations from weeks to days. FlexGen smart NoC IP is also capable of utilizing AI-driven heuristics to achieve up to a 30% reduction in wire length, lowering both power consumption and latency.

Most recently, chip titan AMD licensed FlexGen smart NoC IP to deliver high-performance data transport in AMD’s chiplets across their broad suite of products, from data centers to edge and end devices. This agreement closely follows Renesas’ leveraging of Arteris’ multi-die technology in its R-Car Gen 5 SoC platform for advanced driver-assistance systems (ADAS) that integrate CPUs, AI-enabled NPU, IVI-enabled GPUs, and the ability to further boost AI throughput via chiplet extensions.

Arteris technology can be found in 3.85+ billion units across automotive, enterprise computing, consumer electronics, communications and industrial markets. Arteris has also expanded the ecosystem collaboration to support customer innovation, across any processor, any design, and integrating any IP, from a multitude of XPU compute, to memory and random logic, enabling underlying data movement that is particularly critical to AI applications from the data center to the smart edge.

The continuous innovation advancing the semiconductor industry has not gone unrecognized: Arteris has achieved wins at the AI Breakthrough Awards, American Business Awards, and International Business Awards, taking home a Gold Stevie Award from the latter program for Most Innovative Tech Company of the Year alongside honors for FlexGen, Ncore, and Magillem Registers integration automation software.

Arteris will exhibit at the AI Infra Summit in Santa Clara, California from September 9^th to 11^th. Visit Arteris at booth #517 and hear from Arteris’ EVP Engineering and COO, Laurent Moll in the session on Designing Power Efficient Chips – From the Edge to the Data Center on September 9^th at 2:35pm in the Hardware & Systems Track. To learn more, visit arteris.ai today.   

About Arteris

Arteris is a global leader in system IP used in semiconductors to accelerate the creation of high-performance, power-efficient silicon. Arteris network-on-chip (NoC) interconnect IP and system-on-chip (SoC) integration automation software are used by the world’s top semiconductor and technology companies to improve overall performance, engineering productivity, reduce risk, lower costs, and bring complex designs to market faster. Learn more at arteris.com.