Chiplet Pioneer Eliyan Achieves First Silicon in Record Time with Implementation in TSMC 5nm Process, Confirms Most Efficient Chiplet Interconnect Solution in the Multi-Die Era 2023-05-31 14:27:00 Chiplet
Tenstorrent Partners with LG to Build AI and RISC-V Chiplets for Smart TVs of the Future 2023-05-30 15:00:00 Deals
Fraunhofer IIS/EAS Selects Achronix Embedded FPGAs (eFPGAs) to Build Heterogeneous Chiplet Demonstrator 2023-05-08 14:32:00 Deals
Chiplet Pioneer Eliyan Joins UCIe and JEDEC Industry Standardization Organizations, Expands Veteran Leadership Team to Accelerate Adoption of Breakthrough Die-to-Die Interconnect Solution 2023-01-31 13:43:00 Business
Eliyan Closes $40M Series A Funding Round and Unveils Industry’s Highest Performance Chiplet Interconnect Technologies 2022-11-08 10:49:00 Other
Leaders in Semiconductors, Packaging, IP Suppliers, Foundries, and Cloud Service Providers Join Forces to Standardize Chiplet Ecosystem 2022-03-02 15:23:00 Standards
CEA Combines 3D Integration Technologies & Many-Core Architectures to Enable High-Performance Processors That Will Power Exascale Computing 2020-12-15 15:55:00 Chiplet Enablers