Syenta Raises A$8.8M to Break AI’s Memory Wall with Next-Gen Chip Packaging Technology
2025-08-15 05:49:00
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Silicon 100: Chiplet work spanning interconnect PHYs to smart substrates
2025-08-18 12:29:00
Commentary / Analysis
Syenta Raises A$8.8M to Break AI’s Memory Wall with Next-Gen Chip Packaging Technology
2025-08-15 05:49:00
Business
ASICLAND Initiates Two Chiplet SoC Development Contracts with Primemas Worth a Total of KRW 16 Billion
2025-08-15 04:19:00
Business
OKI Develops Tiling crystal film bonding (CFB) Technology for Heterogeneous Integration of Optical Semiconductors onto 300 mm Silicon Wafers
2025-08-14 05:47:00
Foundries
Cadence Accelerates Development of Billion-Gate AI Designs with Innovative Power Analysis Technology Built on NVIDIA
2025-08-13 13:13:00
EDA
Celestial AI Closes Final Series C1 Round to Accelerate Next-Generation AI Computing
2025-08-13 12:58:00
Business
Rigetti Computing Reports Second Quarter 2025 Financial Results; Announces General Availability of its 36-Qubit Multi-Chip Quantum Computer
2025-08-13 08:43:00
Business
AMI Launches Developer Program for Arm Total Design to Rapidly Accelerate Arm-based Chiplet Development
2025-08-12 15:12:00
Other
Wave Photonics launches its PDK Management Platform with CORNERSTONE as the first user
2025-08-12 13:14:00
EDA
Chiplet Interfaces Embrace Failures
2025-08-12 08:30:00
Commentary / Analysis
Open Compute Project Enables Silicon Diversity in AI Clusters
2025-08-07 07:05:00
Standards
UCIe Consortium Introduces 3.0 Specification With 64 GT/s Performance and Enhanced Manageability
2025-08-05 12:42:00
Standards
Arteris To Provide FlexGen Smart NoC IP In Next-Generation AMD AI Chiplet Designs
2025-08-05 03:59:00
Deals
Meeting the Cleaning Challenges of High-density 3D Heterogeneous Integration Applications
2025-08-04 13:24:00
Commentary / Analysis
Arm Reportedly Weighs Chiplet and Solution Development, Raising Customer Tensions
2025-07-31 12:01:00
Commentary / Analysis
SiMa.ai Expands Strategic Collaboration with Synopsys to Accelerate Automotive AI Innovation
2025-07-30 15:16:00
EDA
When Standards Enable Chiplets
2025-07-30 14:37:00
Commentary / Analysis
Multibeam Secures $31 Million in Series B Financing to Accelerate Global Deployment of E-Beam Lithography Production Solutions
2025-07-30 05:42:00
Business
Alphawave Semi Highlights Why the Next Generation of AI Advances Demand Chiplet Architectures at EE Times: The Future of Chiplets
2025-07-29 09:17:00
Event
CoAsia SEMI and Rebellions Join Forces to Jointly Develop Next-Generation AI Chiplet Based on REBEL
2025-07-29 05:41:00
Business
Silicon 100: Chiplet work spanning interconnect PHYs to smart substrates
2025-08-18 12:29:00
Commentary / Analysis
Syenta Raises A$8.8M to Break AI’s Memory Wall with Next-Gen Chip Packaging Technology
2025-08-15 05:49:00
Business
ASICLAND Initiates Two Chiplet SoC Development Contracts with Primemas Worth a Total of KRW 16 Billion
2025-08-15 04:19:00
Business
OKI Develops Tiling crystal film bonding (CFB) Technology for Heterogeneous Integration of Optical Semiconductors onto 300 mm Silicon Wafers
2025-08-14 05:47:00
Foundries
Cadence Accelerates Development of Billion-Gate AI Designs with Innovative Power Analysis Technology Built on NVIDIA
2025-08-13 13:13:00
EDA
Celestial AI Closes Final Series C1 Round to Accelerate Next-Generation AI Computing
2025-08-13 12:58:00
Business
Rigetti Computing Reports Second Quarter 2025 Financial Results; Announces General Availability of its 36-Qubit Multi-Chip Quantum Computer
2025-08-13 08:43:00
Business
AMI Launches Developer Program for Arm Total Design to Rapidly Accelerate Arm-based Chiplet Development
2025-08-12 15:12:00
Other
Wave Photonics launches its PDK Management Platform with CORNERSTONE as the first user
2025-08-12 13:14:00
EDA
Chiplet Interfaces Embrace Failures
2025-08-12 08:30:00
Commentary / Analysis
Open Compute Project Enables Silicon Diversity in AI Clusters
2025-08-07 07:05:00
Standards
UCIe Consortium Introduces 3.0 Specification With 64 GT/s Performance and Enhanced Manageability
2025-08-05 12:42:00
Standards
Arteris To Provide FlexGen Smart NoC IP In Next-Generation AMD AI Chiplet Designs
2025-08-05 03:59:00
Deals
Meeting the Cleaning Challenges of High-density 3D Heterogeneous Integration Applications
2025-08-04 13:24:00
Commentary / Analysis
Arm Reportedly Weighs Chiplet and Solution Development, Raising Customer Tensions
2025-07-31 12:01:00
Commentary / Analysis
SiMa.ai Expands Strategic Collaboration with Synopsys to Accelerate Automotive AI Innovation
2025-07-30 15:16:00
EDA
When Standards Enable Chiplets
2025-07-30 14:37:00
Commentary / Analysis
Multibeam Secures $31 Million in Series B Financing to Accelerate Global Deployment of E-Beam Lithography Production Solutions
2025-07-30 05:42:00
Business
Alphawave Semi Highlights Why the Next Generation of AI Advances Demand Chiplet Architectures at EE Times: The Future of Chiplets
2025-07-29 09:17:00
Event
CoAsia SEMI and Rebellions Join Forces to Jointly Develop Next-Generation AI Chiplet Based on REBEL
2025-07-29 05:41:00
Business