TSMC Brings Packaging Center Stage with Silicon
April 25, 2025
The worldwide TSMC 2025 Technology Symposium recently kicked off with the first event in Santa Clara, California. These events typically focus on TSMC’s process technology and vast ecosystem. These items were certainly a focus for this year’s event as well. But there is now an additional item that shares the spotlight – packaging technology. Thanks to the increase in heterogeneous integration driven in large part by AI, the ability to integrate multiple dies in sophisticated packages has become another primary driver for innovation. So, let’s look at what was shared at the pre briefing by Dr. Kevin Zhang and how TSMC brings packaging center stage with silicon.
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