JCET’s CPO Solution Accelerates Efficiency and Bandwidth Breakthroughs in Data Interconnect

September 1, 2025 -- In 2025, Co-Packaged Optics (CPO) technology has rapidly advanced toward commercialization. Global tech giants have launched CPO-based switch solutions to reduce energy consumption in data interconnects, while Chinese enterprises have made breakthroughs in integrated optical engines and related sectors. As a leading company in advanced packaging technologies, JCET Group’s CPO solutions provide bandwidth expansion and energy efficiency optimization for high-performance computing and other fields, driving generational upgrades in system architecture.

CPO technology is gaining traction across computing, communications, and autonomous driving applications due to its advantages in high bandwidth, low latency, low power consumption, and high integration. According to market research firm Yole, the CPO market is projected to grow from $46 million in 2024 to $8.1 billion by 2030, with a CAGR of 137%.

An optical engine primarily consists of a photonic integrated chip (PIC) and an electronic integrated chip (EIC). Key components of the PIC include photodetectors, optical waveguides, and high-speed modulators, while the EIC comprises drivers and trans-impedance amplifiers. JCET’s CPO solution integrates the optical engine with ASIC chips for switching and computing on a single substrate using advanced packaging technologies, enabling heterogeneous integration. This approach significantly shortens the interconnection between the optical engine and other chips, enhances bandwidth and port density, improves signal transmission speed and integrity, and provides valuable optimization space for rack layout. 

Reliability is a primary challenge for multi-chip integrated systems. To address this, JCET offers multiple packaging integration solutions for optical engines and flexible layout options for PICs and EICs, while supporting customers in high-speed signal design and simulation. Regarding thermal management, PICs are sensitive to temperature fluctuations. JCET employs thermal interface material stacking technology to minimize temperature variation in PICs. Additionally, shorter optical signal paths reduce parasitic losses, enhancing signal integrity across the system.

Mr. Owen Jin, VP of JCET Group and General Manager of the AI & Smart Industry BU, stated: “The transition from pluggable optical modules to highly integrated CPO devices brings significant system performance improvements and drives value reconstruction across the industry chain. JCET has already partnered with multiple customers in optical engine packaging integration, thermal management, and reliability verification. Moving forward, we will continue to invest in R&D for advanced packaging and heterogeneous integration technologies, promote collaborative innovation across the industry chain, and further strengthen our strategic position in the global semiconductor back-end manufacturing industry.”