Chiplet Summit Announces Its Initial Keynote Schedule With Emphasis on AI Applications
SAN DIEGO -- January 02, 2024 -- The second annual Chiplet Summit, to occur on February 6-8 at the Santa Clara Convention Center, has now set its initial keynote schedule. Speakers will be:
- Subi Kungeri, VP AI System Solutions, Applied Materials
- Abhijeet Chakraborty, VP Engineering, Synopsys
- Gurtej Sandhu, Sr Fellow/VP, Micron
- Tony Chan Carusone, CTO, Alphawave Semi
- Sam Salama, CEO, Hyperion Technologies
- Cliff Grossner and Bapi Vinnakota, Open Compute Project
There will also be short talks by the UCIe Consortium, Silicon Catalyst, and SNIA.
Keynote topics will include AI solutions, design methods, memory, interfaces, new packaging methods, and the open chiplet economy. Attendees will learn how chiplets can make the latest designs take less time, cost less, and be more scalable. Presentations will focus on handling AI applications, such as ChatGPT®.
Summit General Chair Chuck Sobey says, “At our keynotes, attendees hear what industry leaders are planning. AI is an obvious driver everywhere. It requires huge amounts of memory, fast low-latency connections, and the ability to do both training and model execution at top speed. Making it work well takes engineering and R&D that covers all chip design stages.”
To discuss exhibiting, contact:
Elizabeth Leventhal, Exhibit Sales Director
Elizabeth@ChipletSummit.com
+1.760.809.5755
About Chiplet Summit
Chiplet Summit, produced by Semper Technologies, showcases the applications, technologies, and vendors that are driving the chiplet market. To learn more about the Summit, visit https://chipletsummit.com.
Related Chiplet
- Automotive AI Accelerator
- Direct Chiplet Interface
- HBM3e Advanced-packaging chiplet for all workloads
- UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
- UCIe based 8-bit 48-Gsps Transceiver
Related News
- YorChip, Inc. announces its first Chiplet for Edge AI applications with IP licensed from Semidynamics, the leader in RISC-V IP based in Barcelona
- Chiplet Summit to Focus on New Packages and AI Applications in 2025
- DreamBig Semiconductor Announces Partnership with Samsung Foundry to Launch Chiplets for World Leading MARS Chiplet Platform on 4nm FinFET Process Technology Featuring 3D HBM Integration to Solve Scale-up and Scale-out Limitations of AI for the Masses
- Alphawave Semi ‘Redefines Connectivity’ in AI Hardware and Edge AI Summit 2024 Presentation on Chiplet Interconnects
Latest News
- Tokyo Electron and IBM Renew Collaboration for Advanced Semiconductor Technology
- Benefits And Challenges In Multi-Die Assemblies
- NEDO Approves Rapidus’ FY2025 Plan and Budget for 2nm Semiconductor Projects
- Lightmatter Announces Passage L200, the Fastest Co-Packaged Optics for AI
- Alphawave Semi brings High-Speed Connectivity and Compute Solutions at OFC 2025