The Basics of Chiplet Integration and Importance of Adhesive Solutions
By Jillian Carapella, 3DInCites (September 3, 2024)
What You Need to Know as an Industry Newcomer
If you’re a regular reader of 3D InCites, you’ve probably seen the word “chiplets” before, but you may not know what they are. To put it simply, chiplets are small “chips” that perform singular functions really well, but they can’t perform their designated function on their own. Instead, they are designed to be integrated with other chiplets in a package to perform like a full chip.
For instance, a chiplet may be a processor core, a memory block, or something else, and it needs its companion pieces to work effectively. Because of this, some industry leaders like to compare chiplets to Legos.
Chiplets are becoming an increasingly important part of the advanced packaging conversation. With advancements in artificial intelligence (AI), high performance computing (HPC) and other next-generation technologies, more computing power needs to fit in less space than ever before, and chiplets can help make this possible. So, to learn more about chiplet integration, I spoke with Raj Peddi, director of marketing strategy at Henkel. Henkel is a material supplier for the semiconductor packaging industry.
To read the full article, click here
Related Chiplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- EV Group Hybrid Bonding, Maskless Lithography and Layer Transfer Solutions for Heterogeneous Integration to be Highlighted at ECTC 2024
- EV Group Highlights 3D Integration Process Solutions at SEMICON Taiwan 2024
- Imec achieves seamless InP Chiplet integration on 300mm RF Silicon Interposer with excellent performance at 140GHz
- DreamBig Semiconductor Announces Partnership with Samsung Foundry to Launch Chiplets for World Leading MARS Chiplet Platform on 4nm FinFET Process Technology Featuring 3D HBM Integration to Solve Scale-up and Scale-out Limitations of AI for the Masses
Latest News
- Alchip 3DIC Test Chip Tape Out Validates Ecosystem Readiness
- BOS Semiconductors Introduces the Industry’s First Chiplet-Based NPU Samples, Expanding Supply to Global Automotive OEMs
- Arteris Builds on Growth With Product Launches, Strategic Licensing Agreements
- Avicena Names Marco Chisari as New CEO
- Resonac Launches 27-Member "JOINT3" Consortium to Develop Next-Generation Semiconductor Packaging