BoS Semiconductors joins UCIe Consortium for its ADAS chiplet SoC family
BoS Semiconductors is developing the ADAS chiplet SoC family which consist of ADAS SoCs and NPU Accelerators
Korea -- October 28, 2024 – BoS Semiconductors, an automotive fabless company for ADAS SoC and ASIC, today announced that BoS has recently joined the UCIeTM Consortium, an industry organization to build an open ecosystem of chiplets for on-package innovations.
In recent years, as AI workloads have become central to automotive computing systems for autonomous driving and SDV implementations, the need for a high-performance AI NPU core has become evident. However, at the same time, low-spec computing systems are also needed to sell a wide range of vehicles, BoS provides the chiplet SoC family to support different performance segments with one single ADAS SoC and additional NPU Accelerators.
BoS is a Korean start-up company, led by Jaehong Park, a former Samsung Semiconductor Executive Vice President. BoS is developing the ADAS chiplet SoC family which consist of ADAS SoCs and NPU Accelerators.
“We are very delighted to be a member of the UCIe consortium,” said Jaehong CEO and founder of BoS Semiconductors. “The chiplet offering is becoming more critical to our customers and we will deliver our own ADAS chiplet SoC family working with our industry leading partners. The first product is an automotive NPU Accelerator which will be publicly announced at the CES in January 2025.
Related News
- BOS Semiconductors Signed Development Contract for ADAS Chiplet SoC with an European OEM
- BOS and Tenstorrent Unveil Eagle-N, Industry’s First Automotive AI Accelerator Chiplet SoC
- BOS Joins VESA and UCIe to Advance Global Standards in Display and Chiplet Technology
- Leaders in Semiconductors, Packaging, IP Suppliers, Foundries, and Cloud Service Providers Join Forces to Standardize Chiplet Ecosystem
Latest News
- YMTC’s Hybrid Bonding Patents: A Key Competitive Factor for Memory Chipmakers
- Baya Systems Celebrates First Year of Hypergrowth After Emerging from Stealth
- Can You Build A Known-Good Multi-Die System?
- BOS Joins VESA and UCIe to Advance Global Standards in Display and Chiplet Technology
- Arteris Accelerates AI-Driven Silicon Innovation with Expanded Multi-Die Solution