4 takeaways from the 2nd automotive chiplet conference
On October 10 and 11, 2023, the automotive ecosystem convened at imec to talk about what’s now routinely called ‘the chiplet challenge.’ Here are four takeaways from those two days.
1. Chiplets are on everyone’s radar
The number of participating companies had risen from 30 to 50 compared to the first installment of the automotive chiplet conference. It’s safe to say all these people didn’t fly in to enjoy the Belgian autumn weather. They were there because chiplets are a hot topic in the industry.
One participant said, “The question is not if but when chiplets will enter the automotive market.”
It’s a matter of logic: next-level ADAS and in-vehicle infotainment (IVI) features will require compute performance levels that are par with those of data centers or high-end consumer devices. And these markets have already moved to chiplets.
Related Chiplet
- UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
- UCIe based 8-bit 48-Gsps Transceiver
- UCIe based 12-bit 12-Gsps Transceiver
- 400G Transmitter Chiplet for 400G, 800G and 1.6T Pluggable Transceivers
- FPGA Chiplets with 40K -600K LUTS
Related News
- DreamBig World Leading "MARS" Open Chiplet Platform Enables Scaling of Next Generation Large Language Model (LLM), Generative AI, and Automotive Semiconductor Solutions
- Intel to Acquire Silicon Mobility, Intel Commits to Open Automotive Chiplet Platform
- Cadence Collaborates with Arm to Jumpstart the Automotive Chiplet Ecosystem
- Cadence, Siemens back ARM automotive chiplet push
Latest News
- Advanced Packaging Drives New Memory Solutions for the AI Era
- What Comes After HBM For Chiplets
- Optical Chiplet Interconnect Promises to Accelerate Computing Apps
- Safety architecture boosts automotive GPU for chiplets
- Enosemi and GlobalFoundries announce the availability of silicon-validated electronic-photonic design IP available in the GF Fotonix platform