Applied Materials, BESI Push Die-to-Wafer Hybrid Bonding Toward High-Volume Manufacturing

By Pat Brans, EETimes (November 21, 2025)

At SEMICON Europa this week, Applied Materials and BE Semiconductor Industries (BESI) gathered a small group of journalists for a press briefing on what the companies describe as the industry’s first high-volume–ready die-to-wafer hybrid bonding platform. The partners spent five years developing the integrated Kinex system, which is now being adopted in production by logic, memory and OSAT customers.

Hybrid bonding has been discussed for years as a way to break through scaling limits. What is striking, according to the two speakers, is how rapidly demand is accelerating—and how much engineering complexity is still involved.

Increasing interest in hybrid bonding

“Moore’s Law is slowing,” said Chris Scanlan, senior VP of technology at BESI. “Transistor density is still increasing, but at a slower rate. And at the same time, designers are hitting the reticle-size limit. For many high-performance chips, you simply have to split the die and put it back together using advanced packaging.”

To read the full article, click here