Advanced IC Packaging: The Roadmap to 3D IC Semiconductor Scaling
I recently had the privilege of sitting down with Jan Vardaman, President of TechSearch International and a leading authority in semiconductor packaging analysis, to discuss the transformative shifts occurring in integrated circuit design and manufacturing. “Our focus is entirely on advanced packaging, and the developments we’re seeing now are happening faster than ever,” Vardaman explained, setting the stage for an informative discussion about the semiconductor industry’s evolution toward chiplet-based architectures.
As the semiconductor industry approaches a projected market value of $1 trillion by 2030, the transition from traditional monolithic architectures to modular chiplet-based designs represents a fundamental shift in integrated circuit development. During our conversation, Vardaman provided crucial insights into why this transition is occurring: “The reason we’re seeing so much interest in the idea of the chiplet is that it offers a new way to design an IC. We can no longer afford to fabricate everything as a monolithic die on the most expensive nodes.”
To read the full article, click here
Related Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Interconnect Chiplet
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- nepes corporation expands IC packaging capabilities for the 3DIC era with advanced design flows from Siemens
- KLA Unveils Comprehensive IC Substrate Portfolio for a New Era of Advanced Semiconductor Packaging
- TSMC Announces Breakthrough Set to Redefine the Future of 3D IC
Latest News
- Siemens streamlines design and analysis of complex, heterogeneously integrated 3D ICs
- Bruker Experiences Growth in Semiconductor Advanced Packaging Market Fueled by AI Demands
- 2.5D/3D chip technology to advance semiconductor packaging
- Arteris Addresses Silicon Design Reuse Challenge with New Magillem Packaging Product for IP Blocks and Chiplets
- EU Project ELENA Pioneers LNOI Platform for Next-Gen Photonic Circuits & Europe’s 1st Commercial Supplier of LNOI Wafers