Chiplet Ecosystem - Package

YES is a leading provider of differentiated technologies for materials and interface engineering needed for a wide range of applications and markets. YES customers are market leaders, creating next generation...

KLA develops industry-leading equipment and services that enable innovation throughout the electronics industry. We provide advanced process control and process-enabling solutions for manufacturing...

Amkor Technology, Inc. is the world's largest US headquartered OSAT (outsourced semiconductor assembly and test) service provider. Since its founding in 1968, Amkor has pioneered the...

MRSI Systems (Mycronic Group) is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer solutions for research and development,...

Lam Research Corporation (NASDAQ: LRCX) is a global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Lam's equipment and services allow customers to build...

Packaging is a crucial determinant of power, performance and cost. New packaging requirements--thinner wafers, smaller footprints, package integration, 3D designs and wafer-level technology--deliver higher...

SkyWater is a U.S.-based semiconductor manufacturer and a DMEA-accredited Category 1A Trusted Supplier. SkyWater’s Technology as a Service model streamlines the path to production for customers...

Shin-Etsu Chemical Co., Ltd. (Head Office: Tokyo; President: Yasuhiko Saitoh; hereinafter, “Shin-Etsu Chemical”) has developed equipment to manufacture semiconductor package substrates with...

Based on decades of experience in glass processing and substrate manufacturing, sourcing from our 3000 sqm unique world-class laboratory located at our headquarters in Freudenstadt, Germany –...

Headquartered in Nijmegen, the Netherlands, ITEC is a back-end semiconductor equipment manufacturer specializing in high-volume production of semiconductors. ITEC provides the highest productivity assembly,...

Absolics is a leading provider of advanced packaging technologies and services, offering scalable solutions for businesses of high-performance computing. We offer smart, innovative services to dozens...

SK hynix Inc., headquartered in Korea, is the world’s top tier semiconductor supplier offering Dynamic Random Access Memory chips (“DRAM”), flash memory chips (“NAND flash”) and...

ASE is a primary architect of Heterogeneous Integration (HI) - the technology that integrates separately manufactured components into a higher level assembly (System-in-Package or SiP) that in the aggregate...

Adeia is a leading R&D and intellectual property (IP) licensing company that accelerates the adoption of innovative technologies in the media and semiconductor industries. Adeia’s fundamental...

Founded in 2011, Sarcina Technology is the Application Specific Advanced Packaging Service that provides a boutique collaborative experience for small-to-mid-sized IC companies.  It brings a proven...

Deca is the leading independent provider of advanced packaging technology to the semiconductor industry. Our M-Series™ technology is the industry’s highest volume fan-out, powering the world’s...

Silicon Box is an advanced semiconductor integration service provider, specialising in cutting-edge integration technology. We are capable of delivering full execution, from initial design to final manufacturing...

EV Group (EVG) is a leading supplier of high-volume production equipment and process solutions for the manufacture of semiconductors, MEMS, compound semiconductors, power devices and nanotechnology devices. A...

Chipletz, incorporated in 2021, offers Smart Substrate™ products, an advanced packaging technology that addresses the increasing demand for compute performance as Moore's Law slows down. Targeting...