ADC Chiplet Chiplets
Filter
21
Chiplet
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10)
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12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- UCIe based Ka/Ku band transceiver
- Wide Bandwidth
- Scalable solution for dense mm-wave radio into single multi-chip modules
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HBM3e Advanced-packaging chiplet for all workloads
- Scalable AI, fortified with high compute density and ample memory bandwidth
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UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
- 2T2R chiplet configuration
- 160/175-GSa/s sample rate
- 7-bit resolution
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Speedcore eFPGA Chiplet
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Hub Chiplet
- Rich pluggable SoC infrastructure that can help accelerators and CXL solutions reach the market 5x-10x faster with over 10x cost reduction
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High-Density Electronic-Photonic Chiplet
- Parallel electrical interface
- Supports AIB and other proprietary parallel interfaces
- 8 full-duplex optical ports
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Arm Compute Chiplet
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Near-Packaged Optics (NPO) Chiplet Solution
- CPO/NPO connectivity for GPU/Switch/ASIC with integrated OSPic™ all-optical signal processor
- High capacity, low latency up to 10Tbps for scale out CPO
- From 1.6Tbps to 6.4Tbps NPO in-field serviceability with heterogeneous laser integration
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Interconnect Chiplet
- Integrates 16 complete UCIe modules, following the standard UCIe 1.1 standard
- Integrates one complete HBM3 IP, including the controller and PHY, following the HBM3 JESD238 standard
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400G Transmitter Chiplet for 400G, 800G and 1.6T Pluggable Transceivers