By Nitza Basoco, Teradyne
Chiplet-based designs complicate testing and add new urgency to getting it done better and earlier. Developers simply must dispose of bad dies as soon as possible to keep costs and schedules under control. Heterogeneous integration is a particularly expensive and time-consuming new step, while packaging has become much more difficult and much costlier. Good testing is essential to having good silicon at a reasonable price.
