Multi-Die Systems Set the Stage for Innovation

By Abhijeet Chakraborty, VP Engineering, Synopsys
February 7, 2024

So far, the only design teams able to handle multi-die systems are bleeding-edge ones accustomed to breaking new ground with every step. Now the ecosystem is providing the tools, IP, standards, connectivity, and manufacturing needed to allow many more teams to switch to this new approach. Multi-die systems are now the mainstream and open up innovation in AI, security, transaction systems, virtual reality, and other areas. They continue the trend established by Moore’s Law to provide more compute power, more memory and storage, and faster I/O in less space and at lower cost.

Introduction
Agenda
2023 Was an Inflection Point for the Semiconductor Industry
Multi-Die Systems Started to Gain Broad Adoption
Chiplet Designs Are Growing
Increasing Application Volume with Chiplets
Synopsys Multi-Die System Solution
Packaging and IC Now a Continuum
Fanout Wafer Packaging For >2x Reticle
Using AI to Meet the Productivity Challenge
Collaboration is Key
Standardization of Die-to-Die Connectivity
The First UCIe Test Chips for the Chiplet Era
Monitor, Test and Repair Architecture for Multi-Die Systems
Collaborating to Accelerate Chiplet Design
What is Next for Multi-Die Systems
The time is now