By Monte El-Khatib, Director of North American Sales, Faraday Technology
Are you exploring 2.5D or 3D packaging solutions to achieve remarkable density, power efficiency and performance in your complex designs? If so, Faraday is here to help. We provide a complete one-stop-shop solution for advanced packaging that covers the entire design and production processing, including:
- System planning and analysis
- Interposer and substrate design
- Simulation and analysis
- Foundry and OSAT services
Our substantial foundry and OSAT relationships ensure a resilient supply chain from SoC design to finished goods.
Please read Monte El-Khatib’s presentation from December 2024’s Samsung Design Service Partner meeting to learn more about Faraday's one-stop-shop approach to advanced packaging.
