Abhijeet Chakraborty, VP Engineering, Synopsys
Wide adoption of AI has led to strong demand for higher compute performance. Chiplet-based multi-die designs can answer the call using high-bandwidth communications, 3D-enabled IP, and methods for achieving seamless continuity from 2D to 3D. Leading-edge products show that a combination of all the approaches is the key to bringing multi-die designs into production.
