AMD Acquires Enosemi to Accelerate Co-Packaged Optics Innovation for AI Systems

By Brian Amick, Senior Vice President, Technology and Engineering, AMD

May 28, 2025 -- Last week, we welcomed the Enosemi team to AMD, marking the next key step in our rapidly evolving AI strategy. Enosemi has collaborated with us as an external development partner on photonics, and this acquisition extends that successful relationship. Now as part of AMD, the team will help us immediately scale our ability to support and develop a variety of photonics and co-packaged optics solutions across next-gen AI systems.

The elite team of experts and PhD-level talent at Enosemi, based in Silicon Valley, has a proven track record of building and shipping photonic integrated circuits in volume, a unique feat that few select teams have accomplished. Their depth of experience, technical rigor, and track record of execution make them an ideal fit for AMD as we push deeper into high-performance interconnect innovation.

AMD has been building a best-in-class portfolio to address the rapidly evolving needs of AI, from foundational silicon to systems-level integration. That journey has included integrating Xilinx’s industry-leading AI Engines and adaptive SoC technologies, adding advanced data movement and networking capabilities through Pensando, building a world-class software team with the additions of Silo AI and Mipsology, and scaling full rack-level system design with the latest acquisition of ZT Systems.

As AI models grow larger and more complex, the need for faster, more efficient data movement is accelerating. To meet these evolving demands, particularly at the rack scale, optical interconnects offer a compelling path forward. Co-packaged optics can deliver higher bandwidth density and better power efficiency than traditional approaches, representing a transformative step in system architecture where tighter integration between compute and networking is enabled to support the performance and scale that advanced AI workloads require.

As we look ahead, the demands of AI systems will require not just powerful chips, but full-stack innovation across compute, networking, systems architecture, software and more. AMD is uniquely positioned to deliver across this stack, bringing together our industry-leading CPUs, GPUs, and adaptive SoCs with deep networking, software, and system integration expertise.

We’re thrilled to welcome the Enosemi team to AMD and are excited to innovate and accelerate the future of advanced interconnects together.