Ranovus - Chiplet Ecosystem

RANOVUS^® develops and manufactures advanced photonics interconnect solutions to support the next generation of AI/ML workloads in data centers and communication networks. Our team has extensive experience in product development and commercialization of optoelectronic subsystems for the information technology industry.

RANOVUS^®‘ current disruptive portfolio includes Multi-Wavelength Quantum Dot Laser technology and advanced digital and silicon photonics integrated circuit technologies that set a new industry benchmark for the lowest power dissipation, size, and cost for the next generation of optical interconnect solutions. RANOVUS^®’ Odin^® platform is the enabling technology for a new data center architecture optimized for AI/ML workloads.

Odin^® Chiplets and IP Cores

Odin^® 100G optical I/O chiplets and IP cores can be integrated with processors, switches, and memory appliances to enable new data centre architectures for machine learning, artificial intelligence, metaverse, cloud, 5G communications, and defence and aerospace. Data centres are increasingly demanding efficient and cost-effective high-capacity interconnect solutions to meet the exponential growth in data-driven applications like ML/AI and metaverse.

Odin^® 100Gbps optical I/O scales from 8- to 32-cores in a highly footprint-efficient manner by combining RANOVUS^®’ 100Gbps per wavelength monolithic EPIC (Electro-Photonic Integrated Circuit) cores with its proprietary laser and advanced packaging technologies.