Photonic Chiplet Interconnection via 3D-Nanoprinted Interposer
February 22, 2024
Chiplet Technical Papers
Business Analysis of Chiplet-Based Systems and Technology
February 21, 2024
The chiplet universe is coming: What’s in it for you?
February 21, 2024
High-performance, power-efficient three-dimensional system-in-package designs with universal chiplet interconnect express
February 20, 2024
Chiplet Technology: Revolutionizing Semiconductor Design - A Review
February 13, 2024
The Next Frontier in Semiconductor Innovation: Chiplets and the Rise of 3D-ICs
February 12, 2024
Inter-Layer Scheduling Space Exploration for Multi-model Inference on Heterogeneous Chiplets
January 12, 2024
Workflows for tackling heterogeneous integration of chiplets for 2.5D/3D semiconductor packaging
January 12, 2024
Multi-Chiplet Marvels: Exploring Chip-Centric Thermal Analysis
January 11, 2024
Universal Chiplet Interconnect Express: An Open Industry Standard for Memory and Storage Applications
January 11, 2024
Single chiplet type versus multiple chiplet types per wafer methods
January 10, 2024
On hardware security and trust for chiplet-based 2.5D and 3D ICs: Challenges and Innovations
January 5, 2024
Gemini: Mapping and Architecture Co-exploration for Large-scale DNN Chiplet Accelerators
January 2, 2024
A Heterogeneous Chiplet Architecture for Accelerating End-to-End Transformer Models
December 22, 2023
What’s Next for Multi-Die Systems in 2024?
December 14, 2023
Why package lithography matters in heterogeneous chiplet integration
December 13, 2023
DCRA: A Distributed Chiplet-based Reconfigurable Architecture for Irregular Applications
November 30, 2023
Challenges and Opportunities to Enable Large-Scale Computing via Heterogeneous Chiplets
November 30, 2023
Chiplet Cloud: Building AI Supercomputers for Serving Large Generative Language Models
November 29, 2023
Reliability challenges in 3D IC semiconductor design
November 28, 2023
