Advanced Packaging and Chiplets Can Be for Everyone
December 2, 2024
Chiplet Technical Papers
Interfacing silicon photonics for high-density co-packaged optics
November 29, 2024
System-Technology Co-Optimization for Dense Edge Architectures using 3D Integration and Non-Volatile Memory
November 28, 2024
High-Bandwidth Chiplet Interconnects for Advanced Packaging Technologies in AI/ML Applications: Challenges and Solutions
November 27, 2024
Analysis Of Multi-Chiplet Package Designs And Requirements For Production Test Simplification
November 21, 2024
Spiking Transformer Hardware Accelerators in 3D Integration
November 14, 2024
GATE-SiP: Enabling Authenticated Encryption Testing in Systems-in-Package
November 13, 2024
AIG-CIM: A Scalable Chiplet Module with Tri-Gear Heterogeneous Compute-in-Memory for Diffusion Acceleration
November 13, 2024
Chiplever: Towards Effortless Extension of Chiplet-based System for FHE
November 11, 2024
The Survey of Chiplet-based Integrated Architecture: An EDA perspective
November 8, 2024
2D materials-based 3D integration for neuromorphic hardware
November 5, 2024
3D Integration, Advanced Metrology Shape the Semiconductor Landscape
November 4, 2024
Synopsys 3DIO Solution for Multi-Die Integration (2.5D/3D)
November 4, 2024
Communication Characterization of AI Workloads for Large-scale Multi-chiplet Accelerators
October 31, 2024
ControlPULPlet: A Flexible Real-time Multi-core RISC-V Controller for 2.5D Systems-in-package
October 23, 2024
3DIO IP For Multi-Die Integration
October 18, 2024
MFIT : Multi-FIdelity Thermal Modeling for 2.5D and 3D Multi-Chiplet Architectures
October 17, 2024
Complex Heterogeneous Integration Drives Innovation In Semiconductor Test
October 15, 2024
The Evolution of Photonic Integrated Circuits and Silicon Photonics
October 7, 2024
Flexible electronic-photonic 3D integration from ultrathin polymer chiplets
October 2, 2024