VeriSilicon: At present, the company's chiplet business is progressing smoothly
Yicai Global (February 13 2025)
On February 13, VeriSilicon Co., Ltd. (688521.SH) said in an interview with specific objects that as all walks of life enter a critical period of artificial intelligence upgrading, the market demand for large computing power has increased sharply. Against this backdrop, the IC industry is undergoing a transformation from SoC (System-on-a-Chip) to SiP (System-in-Package), which is driven by the improvement of high-performance single-chip integration and complexity, performance and power optimization, yield and design/manufacturing cost improvements, and other considerations. In order to adapt to this development trend, VeriSilicon is upgrading its semiconductor IP (intellectual property), which plays an important role in SoCs, to Chiplet, the core component of SiP, and building a chip design service platform based on Chiplet architecture.
To read the full article, click here
Related Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Interconnect Chiplet
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- Alphawave Semi Collaborates with Arm on High-Performance Compute Chiplet
- A closer look at Arm’s chiplet game plan
- SEMIFIVE Collaborates with OPENEDGES on Chiplet Development
- Polar Bear Tech secures new funding to develop first independent chiplet product library
Latest News
- Untether AI Enters Into a Strategic Agreement with AMD
- Alphawave Semi Tapes Out Breakthrough 36G UCIe™ IP on TSMC 2nm, Unlocking Foundational AI Platform IP on Nanosheet Processes
- How Secure Are Analog Circuits?
- Sarcina Technology advances photonic package design to address key data center challenges
- Imec demonstrates 16nm pitch Ru lines with record-low resistance obtained using a semi-damascene integration approach