Marvell Demonstrates Industry’s First 200G 3D Silicon Photonics Engine to Scale Accelerated Infrastructure
SANTA CLARA, Calif. – March 25, 2024 – Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, will demonstrate its 3D Silicon Photonics (SiPho) Engine this week, the industry’s first highly integrated SiPho engine featuring 32 channels of 200G electrical and optical interfaces for connecting next-generation AI clusters and cloud data centers at multi-terabit speeds.
The Marvell 3D SiPho engine combines hundreds of components such as waveguides and modulators, photodetectors, modulator drivers, trans-impedance amplifiers, microcontrollers, and a host of other passive components into a single, unified device to dramatically boost the performance, bandwidth, and energy efficiency of optical interconnects. The 200 Gbps device delivers 2x the bandwidth, 2x the input/output (I/O) bandwidth density, and 30% lower power per bit versus comparable devices with 100 Gbps electrical and optical interfaces1.
Device integration and greater bandwidth input/output (I/O) density provide a pathway for producing a wide spectrum of optical interconnects optimized for different use cases and form factors ranging from pluggable modules to future co-packaged optics (CPO).
“Silicon photonics has been gaining momentum in coherent optical transceivers for connecting data centers over long distances,” said Vlad Kozlov, CEO and founder of LightCounting. “In its next phase of development, we expect the technology to become more prevalent inside data centers and AI clusters. Our current forecast is for annual growth in shipments to approach 40% through 2028.”
“Advances in optical interconnect technology are necessary to realize the promise of AI and accelerated infrastructure,” said Dr. Loi Nguyen, executive vice president and general manager of Cloud Optics at Marvell. “Our 3D SiPho engine is designed to enable higher bandwidth, higher I/O density, and lower power optical interconnects that scale cloud service providers’ infrastructure to meet the growing bandwidth needs of emerging AI services and applications.”
The demonstration will take place at OFC 2024. this week in San Diego, California.
About Marvell
To deliver the data infrastructure technology that connects the world, we’re building solutions on the most powerful foundation: our partnerships with our customers. Trusted by the world’s leading technology companies for over 25 years, we move, store, process and secure the world’s data with semiconductor solutions designed for our customers’ current needs and future ambitions. Through a process of deep collaboration and transparency, we’re ultimately changing the way tomorrow’s enterprise, cloud, automotive, and carrier architectures transform—for the better.
1. Marvell estimates based on internal testing.
Related Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Interconnect Chiplet
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- Marvell Demonstrates Silicon Photonics Light Engine for Low-power, Rack-scale Interconnect in AI Networks
- Imec: Breaking Connectivity Wall with Silicon Photonics and More
- Silicon Photonics Set for Takeoff
- Lightmatter and ASE Partner to Bring 3D Photonics to Market
Latest News
- Untether AI Enters Into a Strategic Agreement with AMD
- Alphawave Semi Tapes Out Breakthrough 36G UCIe™ IP on TSMC 2nm, Unlocking Foundational AI Platform IP on Nanosheet Processes
- How Secure Are Analog Circuits?
- Sarcina Technology advances photonic package design to address key data center challenges
- Imec demonstrates 16nm pitch Ru lines with record-low resistance obtained using a semi-damascene integration approach