Cadence to Buy Artisan to Support Chiplet, 3D IC Future
By Yashasvini Razdan, EETimes | April 29, 2025
Cadence Design Systems has entered into a definitive agreement to acquire Arm’s Artisan Foundation IP business, complementing its AI and chiplet ambitions. This includes standard cell libraries, memory compilers, and GPIOs—components critical for advanced node SoCs and modular designs.
“With the addition of Arm’s Artisan IP, Cadence will enter the foundation IP market and support new growth across design services and chiplet offerings,” said Boyd Phelps, SVP and GM of the silicon solutions group at Cadence.
To read the full article, click here
Related Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Interconnect Chiplet
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- TSMC Announces Breakthrough Set to Redefine the Future of 3D IC
- UMC Launches W2W 3D IC Project with Partners, Targeting Growth in Edge AI
- UMC Introduces Industry’s First 3D IC Solution for RFSOI, Accelerating Innovations in the 5G Era
- System-level UCIe IP for early architecture analysis of 3D Chiplet Design and Packaging
Latest News
- Untether AI Enters Into a Strategic Agreement with AMD
- Alphawave Semi Tapes Out Breakthrough 36G UCIe™ IP on TSMC 2nm, Unlocking Foundational AI Platform IP on Nanosheet Processes
- How Secure Are Analog Circuits?
- Sarcina Technology advances photonic package design to address key data center challenges
- Imec demonstrates 16nm pitch Ru lines with record-low resistance obtained using a semi-damascene integration approach