What’s Missing In 2.5D EDA Tools
By Brian Bailey, SemiEngineering (March 28, 2024)
While it’s possible to create interposer-based systems today, the tools and methodologies are incomplete, and there is a mismatch with organizations.
Gaps in EDA tool chains for 2.5D designs are limiting the adoption of this advanced packaging approach, which so far has been largely confined to high-performance computing. But as the rest of the chip industry begins migrating toward advanced packaging and chiplets, the EDA industry is starting to change direction.
To read the full article, click here
Related Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Interconnect Chiplet
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- Siemens collaborates with Samsung Foundry to expand 3D-IC enablement tools, optimize other EDA solutions for foundry’s newest processes
- 2.5D Integration: Big Chip Or Small PCB?
- Sarcina Unveils Bump Pitch Transformer Capabilities New Multi-die Technology Radically Alters 2.5D Packaging Landscape
- Siemens and Intel Foundry collaborate to deliver new tools certifications and EMIB/3D-IC innovation
Latest News
- Untether AI Enters Into a Strategic Agreement with AMD
- Alphawave Semi Tapes Out Breakthrough 36G UCIe™ IP on TSMC 2nm, Unlocking Foundational AI Platform IP on Nanosheet Processes
- How Secure Are Analog Circuits?
- Sarcina Technology advances photonic package design to address key data center challenges
- Imec demonstrates 16nm pitch Ru lines with record-low resistance obtained using a semi-damascene integration approach