Chiplets diary: JEDEC’s tie-up with OCP bears first fruit
While the Universal Chiplet Interconnect Express (UCIe) standard for die-to-die interconnect is getting a lot of attention, significant work is also being carried out on another design front: electronic part integration in chiplets. JEDEC, which joined hands with the Open Compute Project Foundation (OCP) in late 2022 to standardize chiplet part descriptions by establishing a framework for the transfer of technology captured in an OCP-approved specification, has provided details about the first major outcome of this collaboration.
The two organizations have jointly announced the integration of OCP’s Chiplet Data Extensible Markup Language (CDXML) and JEDEC’s JEP30 PartModel Guidelines. They claim that integrating CDXML into JEP30 will provide chiplet designers with standardized chiplet part descriptions electronically. “The integration of JEDEC JEP30 and OCP CDXML will create a unified platform that revolutionizes chiplet and electronic part integration,” said Michael Durkan, JEDEC Task Group Chair and PartModel Sponsor.
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